| Customization: | Available |
|---|---|
| Type: | Cu (Copper/Copper-Alloy Welding Electrode) |
| Material: | Wcu 70/30, Wcu 75/25, Wcu 80/20, Wcu 90/10 |
|
Still deciding? Get samples of US$ 8/Piece
Request Sample
|
Suppliers with verified business licenses
Audited Supplier Audited by an independent third-party inspection agency
Copper Tungsten CuW Electrical Contacts presents high closing and breaking performance in applications of high voltage circuit breakers, no matter what the interrupting medium is oil, vacuum, SF6 gas or air environment. When the low melting point copper particles melt and evaporate from the tungsten, those particles absorb large amounts of heat generated by the electrical arc. Apart from the cooling effect of copper tungsten, the high melting point tungsten particles also take credit for the superiority of copper tungsten contact by offering an unmatchable resistance to arc-erosion and a high density.
As an ISO-accredited tungsten alloy products manufacturer, Kefeng is capable of offering various types of tugnsten copper that meet a consistently high standard. We have the capacity to provide a reasonable lead time and handle large-volume sale. We produce various sizes, shapes and
inished parts in forms as wire, rod, bar, sheet, ,strip, foil, sheet, plate, tubing, blanks, semi-finished and custom finished parts or according with
ustomer's drawing paper.
| Composition | Density (g/cm3) | Electrical Conductivity (IACS% Min.) | Thermal Conductivity (W/m-K-1) | Hardness (HRB Min.) |
| WCu 70/30 | 14.0 | 52.1 | 230 | 95 |
| WCu 75/25 | 14.8 | 45.2 | 220 | 99 |
| WCu 80/20 | 15.6 | 43 | 200 | 102 |
| WCu 90/10 | 16.75 | 32.5 | 180 | 107 |
When processing the Copper Tungsten CuW Electrical Contacts Materials, the purity tungsten is pressed, sintered and infiltrated by the oxygen-free copper after the consolidating steps which represents a homogeneous microstructure and low level of porosity. The combination of copper's conductivity with tungsten's high density, hardness and high melting point produces a composite with many preeminent properties of both elements. Copper-infiltrated tungsten boasts such properties as high resistance to high-temperature and arc-erosion, excellent thermal and electrical conductivity and a low coefficient of thermal. The physical and mechanical properties and melting point of tungsten copper material will be positively or oppositely affected by varying the amount of copper tungsten in the composite. As the copper content gradually increases, the electrical and thermal conductivity and thermal expansion exhibit a tendency of being stronger. But the density, electrical resistance, hardness and strength will be weakened when infiltrated with less amount of copper. In the end, an appropriate chemical composition is the utmost importance when considering tungsten copper for specific application need.
The use of Tungsten copper (W-Cu) has greatly increased in many fields and applications due to its unique mechanical and thermophysical properties. Tungsten copper materials exhibit high outstanding performance in the aspects of hardness, strength, conductivity, high temperature, and arc erosion resistance. It has been extensively used for the production of electrical contacts, heat sinkers and spreaders, die-sinking EDM electrodes and fuel injection nozzles.
Tungsten sintering has been studied extensively for many years. Ni is the most substantial activation sintering effect. When 0.2~ 0.5%(mass fraction) nickel powders are added at about 1500ºC, a high density (>98% relative density) will achieve by sintering tungsten powders. However, in the latest tungsten copper electrical contact, sintering tungsten skeleton and tungsten copper mixed powders at a lower temperature by adding small amounts of nickel powders could not achieve a perfect effect. Studies of the activation sintering behavior of tungsten copper mixed powders in detail found that Co and Fe's activation effect was notably higher than that of Ni, especially Co. For instance, 98% relative density can be achieved for Tungsten Copper material.
Moreover, when Co was for activation sintering, a tungsten and Co interface layer with high diffusion was on the surface of the tungsten grain. This promotes the diffusion and sintering of tungsten grain. Instead, when Co(Co 20.5%) was too much, a thicker W and Co layer can form. This would affect the migration and diffusion of materials to reduce the sintering density.
The most significant disadvantage of directly sintering tungsten copper is that tungsten copper's electrical and thermal conductivity is reduced by activation sintering.
| Materials | Wt% Tungsten Content | Wt% Copper Content |
Grade | RWMA Class | Density (g/cc) | Electrical Conductivity (%IACS) | Hardness (HRB) |
| W70Cu30 | 70 | Balance | A5WC | 10 | 14.18 | 47-52 | 88-95 |
| W75Cu25 | 75 | Balance | A10WC | 11 | 14.80 | 42-50 | 96-99 |
| W80Cu20 | 80 | Balance | A30WC | 12 | 15.60 | 41-49 | 99-104 |
For three decades Kefeng Powder Metallurgy has pioneered and produced the best tungsten alloy metal solutions for the world's products, applications and industries.
){kind=link}