Copper Tungsten Cuw or Wcu Heat Sinks and Electronic Packaging Materials

Xi'an Kefeng Powder Metallurgy Co., Ltd.
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  • 3 yrs

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Product Highlights

  • Wide Composition Range: Available from Cu 50 wt.% to Cu 90 wt.% with ratios like 70/30, 75/25, 80/20, 90/10.
  • Customizable Dimensions: Diameter from 1.0mm to 127mm+; Thickness from 0.05mm to 50mm; shapes by drawing.
  • High Thermal Conductivity: Superior thermal conductivity ranging from 180 to 230 W/m-K depending on composition.
  • Arc Erosion Resistance: Excellent resistance to high-temperature and arc-erosion for long electrode life.
  • Low Thermal Expansion: Tailorable coefficient of thermal expansion matching SiC and ceramic substrates.
  • ISO 9001 Certified: Manufacturer is ISO-accredited with over 28 years of experience in quality production.
  • Diverse Product Forms: Available as wire, rod, bar, strip, foil, plate, tube, and custom machined parts.
  • Conflict-Free Material: Manufactures and supplies DRC Conflict Free tungsten alloy materials only.

Product Images of Copper Tungsten Cuw or Wcu Heat Sinks and Electronic Packaging Materials

Copper Tungsten Cuw or Wcu Heat Sinks and Electronic Packaging Materials
Copper Tungsten Cuw or Wcu Heat Sinks and Electronic Packaging Materials pictures & photos
Copper Tungsten Cuw or Wcu Heat Sinks and Electronic Packaging Materials
Copper Tungsten Cuw or Wcu Heat Sinks and Electronic Packaging Materials pictures & photos
Copper Tungsten Cuw or Wcu Heat Sinks and Electronic Packaging Materials
Copper Tungsten Cuw or Wcu Heat Sinks and Electronic Packaging Materials pictures & photos
Copper Tungsten Cuw or Wcu Heat Sinks and Electronic Packaging Materials
Copper Tungsten Cuw or Wcu Heat Sinks and Electronic Packaging Materials pictures & photos
Copper Tungsten Cuw or Wcu Heat Sinks and Electronic Packaging Materials
Copper Tungsten Cuw or Wcu Heat Sinks and Electronic Packaging Materials pictures & photos
Copper Tungsten Cuw or Wcu Heat Sinks and Electronic Packaging Materials
Copper Tungsten Cuw or Wcu Heat Sinks and Electronic Packaging Materials pictures & photos
Copper Tungsten Cuw or Wcu Heat Sinks and Electronic Packaging Materials
  • Copper Tungsten Cuw or Wcu Heat Sinks and Electronic Packaging Materials
  • Copper Tungsten Cuw or Wcu Heat Sinks and Electronic Packaging Materials
    Copper Tungsten Cuw or Wcu Heat Sinks and Electronic Packaging Materials
  • Copper Tungsten Cuw or Wcu Heat Sinks and Electronic Packaging Materials
    Copper Tungsten Cuw or Wcu Heat Sinks and Electronic Packaging Materials
  • Copper Tungsten Cuw or Wcu Heat Sinks and Electronic Packaging Materials
    Copper Tungsten Cuw or Wcu Heat Sinks and Electronic Packaging Materials
  • Copper Tungsten Cuw or Wcu Heat Sinks and Electronic Packaging Materials
    Copper Tungsten Cuw or Wcu Heat Sinks and Electronic Packaging Materials
  • Copper Tungsten Cuw or Wcu Heat Sinks and Electronic Packaging Materials
    Copper Tungsten Cuw or Wcu Heat Sinks and Electronic Packaging Materials
  • Copper Tungsten Cuw or Wcu Heat Sinks and Electronic Packaging Materials
    Copper Tungsten Cuw or Wcu Heat Sinks and Electronic Packaging Materials

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Product Description

Kefeng's Copper tungsten (CuW, WCu) has been regarded as a highly conductive and erasion resistant composite material that is extensively used as copper tungsten electrodes for EDM machining and resistance welding, electrical contacts in high voltage applications, and heat sinks and other electronic packaging materials in thermal applications.

Copper Tungsten Cuw or Wcu Heat Sinks and Electronic Packaging Materials

 

The most common tungsten/copper ratios are WCu 70/30, WCu 75/25, WCu 80/20 and 90/10.  The range of available compositions is from Cu 50 wt.% to Cu 90 wt.%. Our tungsten copper product range includes copper tungsten rod, foil, sheet, plate, tube, tungsten copper rod and machined parts. We are capable of producing copper tungsten plates and sheets with a range of thickness from 0.05mm to 50mm. We also offer copper tungsten rods with diameters from 1.0mm to 127mm or more.

As an ISO-accredited tungsten alloy products manufacturer, Kefeng is capable of offering various types of tugnsten copper that meet a consistently high standard. We have the capacity to provide a reasonable lead time and handle large-volume sale.  
We produce various sizes, shapes and
inished parts in forms as wire, rod, bar, sheet, ,strip, foil, sheet, plate, tubing, blanks, 
semi-finished and custom finished parts or according with
ustomer's drawing paper.


Certification: Corporation is ISO9001 Certified, SGS approved and has been manufacturing the highest quality tungsten alloy metals for over 28 years.
Copper Tungsten Cuw or Wcu Heat Sinks and Electronic Packaging Materials
Product mechnical and physical properties
Composition Density (g/cm3) Electrical Conductivity (IACS% Min.) Thermal Conductivity (W/m-K-1) Hardness (HRB Min.)
WCu 70/30 14.0 52.1 230 95
WCu 75/25 14.8 45.2 220 99
WCu 80/20 15.6 43 200 102
WCu 90/10 16.75 32.5 180 107

They also possess good thermal and electrical conductivity.  We, Kefeng Powder Metallurgy Co., manufactures and supplies DRC Conflict Free material only.
Copper Tungsten Cuw or Wcu Heat Sinks and Electronic Packaging Materials


Characteristics and features
 

When processing the copper tungsten alloy products, the purity tungsten is pressed, sintered and infiltrated by the oxygen-free copper after
the consolidating steps which represents 
a homogeneous microstructure and low level of porosity. The combination of copper's conductivity with tungsten's high density, hardness and high melting point produces a composite with many preeminent properties of both elements.  Copper-infiltrated tungsten boasts such properties as high resistance to high-temperature and arc-erosion, excellent thermal and electrical conductivity and a low coefficient of thermal.  The physical and mechanical properties and melting point of tungsten copper material will be positively or oppositely affected by varying the amount of copper tungsten in the composite.  As the copper content gradually increases, the electrical and thermal conductivity and thermal expansion exhibit a tendency of being stronger.  But the density, electrical resistance, hardness and strength will be weakened when infiltrated with less amount of copper. In the end, an appropriate chemical composition is the utmost importance when considering tungsten copper for specific application need.

 
  1. Low thermal expansion
  2. High thermal and electrical conductivity
  3. Low consumption
  4. High arc resistance

Application
 

The use of Tungsten copper (W-Cu) has greatly increased in many fields and applications due to its unique mechanical and thermophysical properties. Tungsten copper materials exhibit high outstanding performance in the aspects of hardness, strength, conductivity, high temperature, and arc erosion resistance. It has been extensively used for the production of electrical contacts, heat sinkers and spreaders, die-sinking EDM electrodes and fuel injection nozzles.

Copper Tungsten Electrode

Tungsten copper is widely used in applications such as electrodes for sinker electrical discharge machining (EDM) and resistance welding. Copper tungsten EDM electrode is capable of machining hard refractory alloys such as titanium carbide and tungsten carbide. Copper tungsten can yield a better MMR (material removal rate) at a low level of TWR (tool wear rate) in comparison to copper, graphite, and other common materials electrodes. In addition, copper tungsten electrodes will become more desirable to utilize if the machining work requires high accuracy in dimension or an intricated geometry.

Therefore, copper tungsten is a relatively cost-saving and efficient option with respect to overcoming machining difficulties caused by a high melting temperature, and high thermal shock and abrasion resistance. Tungsten copper composites are also a preferred gourp of material in resistance welding electrodes. This is both because of the excellent conductivity of copper and the high melting point and the corrosion resistance of tungsten.

Copper Tungsten Heat Sink And Packaging Material

Copper tungsten is a promising material commonly utilized in integrated circuits and high-power microelectronic devices as heat sink and packaging materials. Tungsten copper alloy exhibited superior thermal conductivity and machinability. Most importantly, copper tungsten composites process a relatively low and tailorable coefficient of thermal expansion. In addition, the CTE range of copper tungsten composites overlapped with that of semiconductor materials like SiC and ceramics substrate materials like Aluminum oxide (Al2O3) and Beryllium oxide (BeO). Therefore, WCu composite can be tailored to a close CTE to each material and efficiently prevent them from the damage of thermal stress fatigue.

Copper Tungsten Contact

Copper tungsten contact presents high closing and breaking performance in applications of high voltage circuit breakers, no matter what the interrupting medium is, e.g. an oil, vacuum, SF6 gas, or air environment. When the low melting point copper particles melt and evaporate from the tungsten skeleton, those particles absorb large amounts of heat generated by the electrical arc. Apart from the cooling effect of copper tungsten, the high melting point tungsten particles also take credit for the superiority of copper tungsten contact by offering an unmatchable resistance to arc-erosion and a high density.

Copper Tungsten Nozzle

Copper tungsten (Cu W) has also been proven to be one of the preferred materials for aviation and aerospace applications. Tungsten has a low thermal expansion and a high melting point. At the same time, the copper infiltrates contribute an exceptional transpiration cooling effect to the copper tungsten components when the working temperature is from 2000oC to 3300 oC.  Therefore, the infiltrated tungsten provides superior resistance to thermal shock. It is critical to ensure the complex machined component maintains a stable condition and accurate dimension. These advantageous properties are why copper tungsten is widely used to make high-temperature resistance components such as the nozzles and throats of missiles and rockets.

 
  1. Resistance welding electrodes
  2. Circuit breakers (air or oil immersed)
  3. Arcing tips
  4. Heavy-duty contactors
  5. EDM electrodes
  6. Make-and-break contacts
  7. Relays/switches

Technical parameters
Materials Wt% Tungsten Content Wt%
Copper Content
Grade RWMA Class Density (g/cc) Electrical Conductivity (%IACS) Hardness (HRB)
W70Cu30 70 Balance A5WC 10 14.18 47-52 88-95
W75Cu25 75 Balance A10WC 11 14.80 42-50 96-99
W80Cu20 80 Balance A30WC 12 15.60 41-49 99-104
Note: The values are typical and not to be used for specifications.



Copper Tungsten Cuw or Wcu Heat Sinks and Electronic Packaging MaterialsCopper Tungsten Cuw or Wcu Heat Sinks and Electronic Packaging MaterialsCopper Tungsten Cuw or Wcu Heat Sinks and Electronic Packaging MaterialsCopper Tungsten Cuw or Wcu Heat Sinks and Electronic Packaging MaterialsCopper Tungsten Cuw or Wcu Heat Sinks and Electronic Packaging Materials
For three decades Kefeng Powder Metallurgy has pioneered and produced the best tungsten alloy metal solutions for the world's products, applications and industries.


-Our products are subjected to rigorous physical testing, including density, tensile, yield strength,conductivity, elongation and hardness.

-Our products are identified at all stages of the production process and are thoroughly analized and checked before delivery.

-Our products can be supplied with full verification in accordance with specifications,whatever
Chemically, mechanically or physically.

At Kefeng Metallurgy,our expert and equipment are committed to providing the best tungsten alloy
Refractory metal solution that performs our customer's requirements and improving overall quality.

 

About the Supplier

This supplier has been audited by SGS. Verify the report on the official SGS website with ID "QIP-ASI249229". Items marked "verified" are certified.

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Xi'an Kefeng Powder Metallurgy Co., Ltd.
Xi'an Kefeng Powder Metallurgy Co., Ltd.
Xi'an Kefeng Powder Metallurgy Co., Ltd.
Xi'an Kefeng Powder Metallurgy Co., Ltd.
Xi'an Kefeng Powder Metallurgy Co., Ltd.
Xi'an Kefeng Powder Metallurgy Co., Ltd.
Xi'an Kefeng Powder Metallurgy Co., Ltd.
Xi'an Kefeng Powder Metallurgy Co., Ltd.

About Our Factory & Business Background

Address
Roomb403, Qitushidai Building, No. 14 Huo Ju Road, Xi'an, Shaanxi, China
Terms of Payment
LC, T/T
International Commercial Terms(Incoterms)
FOB, EXW, CFR, CIF
Average Lead Time
Peak Season Lead Time, one month, Off Season Lead Time, one month
Nearest Port
Shanghai, Tianjing

Our Production Capability & Technical Expertise

Main Products
Tungsten Heavy Metal Alloys, Tungsten Rod, China Tungsten Alloy Radiation Shielding Factory, Tungsten Alloy Ball and Cube, Tungsten Plate, Tungsten Ring, Tungsten Alloy Block, Tungsten Alloy Balance, Tungsten Counterweights\tand Shielding, Tuntungsten Based Heavy Metal Alloy

Our Industry Experience & Global Business Record

Export Year
1999-07-17
Main Markets
North America, South America, Eastern Europe, Southeast Asia, Mid East, Western Europe

FAQ

What are the available tungsten to copper ratios?
The most common ratios are WCu 70/30, 75/25, 80/20, and 90/10, with a total composition range from Cu 50 wt.% to Cu 90 wt.%.
Can the product dimensions be customized?
Yes, we offer standard or custom dimensions. Rods range from 1.0mm to 127mm+, and plates/sheets range from 0.05mm to 50mm thickness, or according to customer drawings.
What are the primary applications for copper tungsten?
It is extensively used for EDM electrodes, resistance welding electrodes, electrical contacts, heat sinks, and packaging materials in high-voltage and thermal applications.
What certifications does the manufacturer hold?
Kefeng is ISO 9001 certified and SGS approved, with over 28 years of manufacturing experience ensuring high-quality standards.
What forms are available for copper tungsten products?
Products are available as wire, rod, bar, strip, foil, sheet, plate, tube, blanks, semi-finished parts, and custom finished parts.
What is the lead time for production?
The average lead time is one month for both peak and off-peak seasons.
Does the material offer low thermal expansion?
Yes, copper tungsten composites have a relatively low and tailorable coefficient of thermal expansion, suitable for semiconductor and ceramic applications.
Are the products subjected to quality testing?
Yes, all products undergo rigorous physical testing including density, tensile, yield strength, conductivity, elongation, and hardness checks before delivery.

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